About us
JHI｜Expanding Southeast Asian Market
Leading the future wafer technology blueprint
JHI established an overseas branch in penang, Malaysia in 2023. adhering to the concept of "professional, precise and responsible", it serves global customers, continues to expand its resource map, and deeply cultivates the Southeast Asian market to meet diverse needs.
We are deeply engaged in the field of semiconductor and optoelectronic materials, providing various high-quality wafers to major packaging and testing factories in the world, continuously promoting the global development of enterprises, and strengthening supply chain flexibility and market competitiveness.
Main product items
Wafer Material:
Silicon Wafer, Bare Wafer, Taiko Wafer, RDL Wafer, Wlcsp Wafer, FCBGA, C4 bump wafer, Reclaim Wafer, Dummy Wafer, Pattern Wafer, Customized circuit wafer
Metals and compounds:
Gold, silver, copper, tungsten, titanium, molybdenum, nickel, chromium, aluminum, aluminum copper, aluminum silicon copper, oxide, Nitride, TEOS, Nitrade, etc.
Processing and manufacturing:
Solder ball wafer, carrier wafer, coating wafer, baffle wafer, PAD WAFER, laser cutting wafer, high flat wafer, wire bonding wafer, grinding and polishing, Daisy Chain Wafer, Test Vehicle Wafer, TSV / TGV Wafer, C4 bump, Cu pillar bump, Golden Wafer, yellow light operation, metal sputtering, metal electroplating, etc.
JHI is committed to integrating Taiwan's semiconductor resources and expanding to Southeast Asia, providing diversified one-stop services, working with customers to create a win-win situation and realize a common vision.