JHI｜Expanding Southeast Asian Market

Leading the future wafer technology blueprint
JHI established an overseas branch in penang, Malaysia in 2023. adhering to the concept of "professional, precise and responsible", it serves global customers, continues to expand its resource map, and deeply cultivates the Southeast Asian market to meet diverse needs.
 
We are deeply engaged in the field of semiconductor and optoelectronic materials, providing various high-quality wafers to major packaging and testing factories in the world, continuously promoting the global development of enterprises, and strengthening supply chain flexibility and market competitiveness.
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Main product items

Wafer Material:
（Silicon Wafer）、Bare Wafer、Taiko Wafer、RDL Wafer、Wlcsp Wafer、FCBGA、C4 bump wafer、Pilot Wafer 、Mirror Wafer 、Reclaim Wafer、Dummy Wafer、Pattern Wafer、Daisy Chain Wafer
Metals and compounds:
Gold, silver, copper, tungsten, titanium, molybdenum, nickel, chromium, aluminum, aluminum copper, aluminum silicon copper, oxide, Nitride, TEOS, Nitrade, etc.
Processing and manufacturing:
Solder ball wafer, carrier wafer, coating wafer, baffle wafer, PAD WAFER, laser cutting wafer, high flat wafer, wire bonding wafer, grinding and polishing, Daisy Chain Wafer, Test Vehicle Wafer, TSV / TGV Wafer, C4 bump, Cu pillar bump, Golden Wafer, yellow light operation, metal sputtering, metal electroplating, etc.
JHI provided  Fan-out Packaging Service Platform – Technology Development and Industrial Applications:
Driven by the rapid advancement of applications such as Artificial Intelligence (AI), High-Performance Computing (HPC), Chiplets, and heterogeneous integration, advanced packaging technology is evolving toward high-density interconnects, high-speed data transmission, and multi-chip integration. Fan-out packaging has emerged as a key technology platform in this landscape. However, developing packaging for 8-inch and 12-inch silicon wafers involves significant complexity—including photomask design, multi-layer Redistribution Layers (RDL), Cu pillar/solder bump fabrication processes, and reliability verification—resulting in high development costs and lengthy verification cycles for IC design firms, startups, material suppliers, and equipment manufacturers. To reduce development costs for advanced packaging processes and enhance verification efficiency, JHI Co., LTD has established a pilot production line for fan-out packaging, offering a one-stop integrated service that covers design, manufacturing processes, and packaging. This platform enables multiple customers to share the same wafer for product development and technical verification, drastically cutting prototyping costs and shortening the product development timeline to accelerate commercialization.
 
 
JHI is committed to integrating Taiwan's semiconductor resources and expanding to Southeast Asia, providing diversified one-stop services, working with customers to create a win-win situation and realize a common vision.
Globalization, providing various types of wafers to major packaging and testing plants around the world
 ✅ Passed ISO quality certification, ESG, AEO
 ✅ Focus on production, agency, and distribution, mainly semiconductors and optoelectronic materials
 ✅Quality insistence- SGS、ISO9001：2015、ROHS…etc Professional certification
 ✅ Meets world-class green environmental protection requirements!
 
 
AOI wafer smart inspection equipment
 ✅ Provide product COA and assist in developing customized products
 ✅ Full-featured AOI wafer smart inspection equipment
 ✅ Provide data such as wafer diameter/thickness/bow/warp/TTV/defects...etc.
 ✅ Reduce personnel visual errors
 ✅ Provide COA (shipping inspection report) for each wafer product
 ✅ Provide surface roughness (RA) values
Related wafer materials- 4 inches to 12 inches
 ✅ Wafer materials
 ✅All integrated solutions of fusion bonding technology are based on oxide, silicon nitride or oxynitride compounds as dielectric bonding materials (such as TEOS Wafer, etc.), using Cu or other metals as interconnect materials; These materials are standard materials used in the most advanced IC production lines today.
 ✅ The product uses new aluminum-plated (AL) wafers with a thickness of 0.5um ~ 5um.
 ✅ New product customization Taiko wafer! Customized Daisy Chain Wafer, Test vehicle wafer,TSV Wafer, TGV Wafer, Pattern wafer, RDL Wafer, Wafer carrier,WLCSP Wafer, PAD Wafer, Wire bonding wafer, PE-TEOS...etc.
 
New product ! 8-inch 12-inch probe card .Test wafer.Fine pitch
 ✅ Various Glass Wafer and Aluminum Coated Wafer（PVD etc）
 ✅ Including 6, 8, and 12-inch products，Market Applications and Wafer Carriers for Mini and Micro LED Bonding.
 ✅ RF FEM、MEMS、power semiconductors, 5G optical fiber communications, LED image sensing (image detection),bonding Carrier and other fields are widely used
 ✅ Applications: Home electronic appliances, automotive defense, aerospace, data communications, IoT, 5G, Mini, Micro LED, customized silicon wafer laser engraving (serial numbering, Lot No …etc.)
 
 
Chemical / Electro-less Plating Service
Provide customers with the preparation of metal layers on Ti, Cu, AL PAD pads，Ex. NiPdAu(ENEPIG) or NiAu(ENIG)
 ✅Existing metal combination：Ni/Pd/Au (ENEPIG) and Ni/Au (ENIG)，Thickness adjustment according to customer needs
 ✅ Applicable to Ti、Cu、Al、AlCu、AlSi、AlSiCu、Pad 
 ✅Applicable to 6inches .8inches .12inches Wafer
 
 
Thin FILM & Metalization
OxideThermal SiO₂
PE-SiO₂
PE-TEOS
LPCVD-TEOS
Low-kBlack Diamond
CORAL
SiON
Metal- Ta, Ti, Cr
- Cu, Al, AlCu, AlSi, Ag, NiPdAu
NitrateLP-CVD SiN (Nitrate)
PE-CVD SiN (Nitrate)
New product ! 8-inch 12-inch probe card .Test wafer.Fine pitch
 ✅ Various Glass Wafer and Aluminum Coated Wafer（PVD etc）
 ✅ Including 6, 8, and 12-inch products，Market Applications and Wafer Carriers for Mini and Micro LED Bonding.
 ✅ RF FEM、MEMS、power semiconductors, 5G optical fiber communications, LED image sensing (image detection),bonding Carrier and other fields are widely used
 ✅ Applications: Home electronic appliances, automotive defense, aerospace, data communications, IoT, 5G, Mini, Micro LED, customized silicon wafer laser engraving (serial numbering, Lot No …etc.)
 
 
Chemical / Electro-less Plating Service
Provide customers with the preparation of metal layers on Ti, Cu, AL PAD pads，Ex. NiPdAu(ENEPIG) or NiAu(ENIG)
 ✅Existing metal combination：Ni/Pd/Au (ENEPIG) and Ni/Au (ENIG)，Thickness adjustment according to customer needs
 ✅ Applicable to Ti、Cu、Al、AlCu、AlSi、AlSiCu、Pad 
 ✅Applicable to 6inches .8inches .12inches Wafer
 
 
Thin FILM & Metalization
OxideThermal SiO₂
PE-SiO₂
PE-TEOS
LPCVD-TEOS
Low-kBlack Diamond
CORAL
SiON
Metal- Ta, Ti, Cr
- Cu, Al, AlCu, AlSi, Ag, NiPdAu
NitrateLP-CVD SiN (Nitrate)
PE-CVD SiN (Nitrate)
 
Related wafer materials- 4 inches to 12 inches
 ✅ Wafer materials
 ✅All integrated solutions of fusion bonding technology are based on oxide, silicon nitride or oxynitride compounds as dielectric bonding materials (such as TEOS Wafer, etc.), using Cu or other metals as interconnect materials; These materials are standard materials used in the most advanced IC production lines today.
 ✅ The product uses new aluminum-plated (AL) wafers with a thickness of 0.5um ~ 5um.
 ✅ New product customization Taiko wafer! Customized Daisy Chain Wafer, Test vehicle wafer,TSV Wafer, TGV Wafer, Pattern wafer, RDL Wafer, Wafer carrier,WLCSP Wafer, PAD Wafer, Wire bonding wafer, PE-TEOS...etc.
 
Semiconductor Advanced Packaging: RDL Process (Redistribution Layer Technology)
 ✅ RDL (Redistribution Layer) is a critical technology in semiconductor advanced packaging, widely used in Fan-Out packaging (FOWLP/FOPLP) and particularly suited for high-end electronic products such as 5G, AIoT, and HPC devices. Through metal routing and bumping processes, RDL redistributes the IC's original I/O connections, thereby enhancing design flexibility and reliability. It supports packaging requirements for multi-chip configurations and 3D SiP (System-in-Package) solutions, while offering advantages such as reduced stress and improved component durability.
 ✅ Widely used in power management ICs, magnetic couplers, high-speed memory, RF modules, pressure sensors, high-frequency components, and more.
 ✅ *Customized services are available to meet specific client requirements; please contact us via phone or email for further inquiries regarding customization.
 
 
 
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