JHI provided Fan-out Packaging Service Platform – Technology Development and Industrial Applications:

 
Driven by the rapid advancement of applications such as Artificial Intelligence (AI), High-Performance Computing (HPC), Chiplets, and heterogeneous integration, advanced packaging technology is evolving toward high-density interconnects, high-speed data transmission, and multi-chip integration. Fan-out packaging has emerged as a key technology platform in this landscape. However, developing packaging for 8-inch and 12-inch silicon wafers involves significant complexity—including photomask design, multi-layer Redistribution Layers (RDL), Cu pillar/solder bump fabrication processes, and reliability verification—resulting in high development costs and lengthy verification cycles for IC design firms, startups, material suppliers, and equipment manufacturers. To reduce development costs for advanced packaging processes and enhance verification efficiency, JHI Co., LTD has established a pilot production line for fan-out packaging, offering a one-stop integrated service that covers design, manufacturing processes, and packaging. This platform enables multiple customers to share the same wafer for product development and technical verification, drastically cutting prototyping costs and shortening the product development timeline to accelerate commercialization.
✅ RDL (Redistribution Layer) is a critical technology in semiconductor advanced packaging, widely used in Fan-Out packaging (FOWLP/FOPLP) and particularly suited for high-end electronic products such as 5G, AIoT, and HPC devices. Through metal routing and bumping processes, RDL redistributes the IC's original I/O connections, thereby enhancing design flexibility and reliability. It supports packaging requirements for multi-chip configurations and 3D SiP (System-in-Package) solutions, while offering advantages such as reduced stress and improved component durability.
✅ Widely used in power management ICs, magnetic couplers, high-speed memory, RF modules, pressure sensors, high-frequency components, and more.
✅ *Customized services are available to meet specific client requirements; please contact us via phone or email for further inquiries regarding customization.
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